Resin Bond Cut-off Wheels Diamond for Processing Cemented Carbide

Product Details
Customization: Available
Blade Type: Circle
Manufacturing Process: Sintered
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Manufacturer/Factory, Trading Company
Diamond Member Since 2019

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  • Resin Bond Cut-off Wheels Diamond for Processing Cemented Carbide
  • Resin Bond Cut-off Wheels Diamond for Processing Cemented Carbide
  • Resin Bond Cut-off Wheels Diamond for Processing Cemented Carbide
  • Resin Bond Cut-off Wheels Diamond for Processing Cemented Carbide
  • Resin Bond Cut-off Wheels Diamond for Processing Cemented Carbide
  • Resin Bond Cut-off Wheels Diamond for Processing Cemented Carbide
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Basic Info.

Model NO.
R4
Application
Concrete
Size
50-900mm
Character
Sharp
Delivery
3-7days
Sample
Free
Material
Diamond
Segment
Ultra-Thin
Transport Package
Carton
Trademark
BOSDI
Origin
China
HS Code
8202391000
Production Capacity
5000PCS/Day

Product Description

Dimension Dimension Speed Speed
(mm) (Inch) (r.P.M) M/S
100*1.6*10 4*1/16*3/8 15200 80m/s
100*1.6*16 4*1/16*5/8 15200 80m/s
107*1.2*16 4*3/64*5/8 15300 80m/s
115*1.0*22.23 4-1/2*1/25*7/8 13300 80m/s
115*1.6*22.23 4-1/2*1/16*7/8 13300 80m/s
125*1.0*22.23 5*1/25*7/8 12200 80m/s
125*1.6*22.23 5*1/16*7/8 12200 80m/s
150*1.0*22.23 6*1/25*7/8 10200 80m/s
150*1.6*22.23 6*1/16*7/8 10200 80m/s
180*1.6*22.23 7*1/16*7/8 8600 80m/s
230*2.0*22.23 9*5/64*7/8 6600 80m/s
 

 
Resin Bond Cut-off Wheels Diamond for Processing Cemented Carbide
High Quality Diamond Cut-off Wheels for Sapphire Standard 1A1R Shape with Resin or Metal Bonded.
Diamond Cut-off Wheels are used for efficient cutting of hard, short-chipping and wear resistant materials such as glass, ceramics and carbide, graphite, quartz, ferrite and semiconductor materials.

 
Resin Bond Cut-off Wheels Diamond for Processing Cemented Carbide
Resin Bond Cut-off Wheels Diamond for Processing Cemented Carbide
Resin Bond Cut-off Wheels Diamond for Processing Cemented Carbide



 
 

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