Cu Ni Ti Cladding Diamond Grain for Making Diamond Grinding Wheel

Product Details
Customization: Available
Type: Diamond
Classification of Diamond: Artificial
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Diamond Member Since 2019

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  • Cu Ni Ti Cladding Diamond Grain for Making Diamond Grinding Wheel
  • Cu Ni Ti Cladding Diamond Grain for Making Diamond Grinding Wheel
  • Cu Ni Ti Cladding Diamond Grain for Making Diamond Grinding Wheel
  • Cu Ni Ti Cladding Diamond Grain for Making Diamond Grinding Wheel
  • Cu Ni Ti Cladding Diamond Grain for Making Diamond Grinding Wheel
  • Cu Ni Ti Cladding Diamond Grain for Making Diamond Grinding Wheel
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  • Overview
  • Series of Coated Diamond
  • Detailed Photos
  • Available Size
  • Feature
  • Characteristics
  • Application
  • Production process
Overview

Basic Info.

Model NO.
Ni/Ti/Cu
Characteristic
High Hardness High Strength
Application
Polishing, Grinding, Abrasive
Certificate
ISO9001
Purity
99.9%
Delivery
3-5 Business Days
Coated Material
Ni/Ti/Cu/Si/W/Cr/Co
Transport Package
Plastic, Bottle, Carton
Specification
0-0.5um to 700/800
Trademark
Harmony
Origin
China
HS Code
71051020
Production Capacity
5, 000, 000 Carat/Year

Product Description

 

Coated Diamond Powder

Coated diamond is divided into electrolytic and chemical plating, it includes Ni coating, Cu coating, Ti coating, Cr coating etc. Coated diamond effectively increase holding force between diamond and bonding, reduce thermal shock, protect diamond against oxidation and graphite, lengthen product lifetime.

Series of Coated Diamond

HID Ni Coated Diamond
Description:Nickel coating diamond powders are generally divided into two different produce coating types: electroplating and chemical plating;
Two different gain weight way: gain weight 30%; gain weight 56%.
Rough and spiny surface, improve the retention between diamond and bond, avoid the diamond peeling off early, thus, extend the service life of diamond tools.
Recommend for making resin bond diamond tools.


Application: Electroplating Nickel products mainly used in resin bond products with dry and wet abrasives, effectively improve the holding force with good thermal stable ability, avoid carbonization in high speed cutting. Chemistry plating Nickel products mainly used in resin bond products with dry and wet abrasives, no external current conditions, and deposited metal on diamond surface by process of self-catalytic redox reactions, form the thickness and density of nickel-plated.

 

Grade HID Cu Coated Diamond
Description: Recommend for resin bond tools. Able to effectively enhance the tools life by improving the mechanical retention of diamonds and reducing heat damage.

Characteristics: Effectively enhance the tools life by improving the mechanical retention of diamonds and reducing heat damage.

 

Grade HID Ti Coated Diamond
The coating greatly enhances the mechanical attachment of diamond to the bond matrix through the strong metallurgical adhesion between Ti and the matrix. It also protects diamond from oxidation or metal erosion which causes graphitization of the diamond, therefore, improves the application features of diamond tools.

 

Grade HID Si Coated Diamond
Silicon coating strengthens the retention between bond and diamond, improves the thermal stability, wear resistance and helps better conduct the heat. It also helps to avoid the corrosion from Fe, thus it protects the diamond, prolongs the tools' life and raises the sintering temperature.

 

Grade HID W Coated Diamond
W reacts with diamond particles and generates WC, which is with good thermal stability and wear resistance. The coating improves the bond retention and enhances the diamond toughness, its alloy coating layer improves the thermal conductivity, which can prolong tool life.

 

Grade HID Co Coated Diamond
Cobalt coating could improve the retention of diamond and bond. In addition, the sintering temperature could be raised because the coating can protect diamond from oxidation and corrosion. It also enhences the hardness and abrasive resistence of coated diamond.


Grade HID Cr Coated Diamond
Chromium enjoys nice wettability and affinity on diamond. It forms a layer of chromium-carbide between diamond and bond during coating and sintering, thus the coating improves the retention between diamond and bond. It also increases the hardness and abrasive resistance of coated diamond.

Detailed Photos
Cu Ni Ti Cladding Diamond Grain for Making Diamond Grinding Wheel
Cu Ni Ti Cladding Diamond Grain for Making Diamond Grinding Wheel
Cu Ni Ti Cladding Diamond Grain for Making Diamond Grinding Wheel
Cu Ni Ti Cladding Diamond Grain for Making Diamond Grinding Wheel
Cu Ni Ti Cladding Diamond Grain for Making Diamond Grinding Wheel
Cu Ni Ti Cladding Diamond Grain for Making Diamond Grinding Wheel
Available Size
Micron
4-6 4-8 5-10 6-12 8-12 8-16
10-15 10-20 12-22 15-25 20-30 22-36
20-40 30-40 35-45 40-50 45-50 50-60
Mesh
50/60 60/70 70/80 80/100 100/120 120/140
140/170 170/200 200/230 230/270 270/325 325/400

Particle Size Distribution Specification for Superabrasive Grains

Size D10≥(µm) D50(µm) D95≤(µm) Max(µm) Min(µm)
0-0.25 0.1 0.170~0.210 0.38 -- --
0-0.5 0.12 0.220~0.280 0.51 --- --
0-1 0.42 0.501~0.580 0.795 1.156 0.375
0.5-1 0.472 0.581~0.690 1.053 1.375 0.375
0.5-1.5 0.504 0.691~0.871 1.298 1.945 0.375
0-2 0.62 0.872~0.985 1.542 2.312 0.446
1/2 0.761 0.986~1.224 1.894 3.27 0.63
0.5-3 0.94 1.225~1.487 2.401 3.889 0.63
1/3 1.048 1.488~1.712 2.882 4.625 0.75
1.5-3 1.169 1.713~2.014 3.321 5.5 0.75
2/3 1.392 2.015~2.302 3.663 6.541 0.892
2/4 1.644 2.303~2.754 4.496 7.778 0.892
2/5 1.803 2.755~3.312 5.5 9.25 1.06
3/6 2.448 3.313~3.898 6.386 11 1.499
3/7 2.913 3.899~4.676 7.566 13.08 1.783
4/8 3.605 4.677~5.400 8.455 15.56 2.121
4/9 3.952 5.401~6.062 9.762 18.5 2.522
5/10 4.401 6.063~6.700 10.98 18.5 2.999
5/12 5.022 6.701~7.673 12.95 22 3.566
6/12 5.807 7.674~8.549 13.97 26.16 4.241
7/14 6.411 8.550~9.483 15.13 26.16 4.241
8/16 7.113 9.484~10.78 17.82 31.11 5.044
8/20 8.102 10.79~12.56 20.6 37 5.998
10/20 9.186 12.57~14.18 22.54 37 7.133
12/22 10.53 14.19~16.05 24.41 44 7.133
12/25 12.01 16.06~17.65 26.61 44 8.482
15-25 13.32 17.66~19.55 29.75 52.33 10.09
20-30 15.04 19.56~22.50 34.64 62.23 12
22-36 17.28 22.51~26.12 39.98 74 12
30-40 20.11 26.13~30.10 46.56 88 14.27
30-50 22.36 30.11~34.58 52.87 88 16.96
36-54 25.68 34.59~39.00 60.94 104.7 20.17
40-60 29.45 39.01~43.20 69.86 124.5 20.17
50-70 32.42 43.21~47.50 72.65 124.5 23.99
54-80 36.56 47.51~52.50 80.74 124.5 23.99

 

Abrasive Materials Mesh Size Comparison List

HARMONY     U.S.A JAPAN   RUSSIA
GB/T6406-1995 ISO FEPA ANIS B74.16-1971 JIS4130-1988 Theoretlcal 9206-80
Baslc Size
Grain No Grain Size Grain No 1 Grain No 2 Grain Size Grain No Grain Size Grain No Grain Size Grain No Grain Size Inch Mlllmeter Grain No Grain Size
40/50 425/300 427 40/50 425/300 B/427 355/300 40/50 425/300 40/50 425/300 0.015 0.378 500/400 500/400
50/60 300/250 301 50/60 300/250 B/301 300/250 50/60 300/250 50/60 300/250 0.011 0.288 400/315 400/315
60/80 250/180 252 60/80 250/180 B/252 250/180 60/80 250/180 60/80 250/180 0.009 0.226 250/200 250/200
80/100 180/150 181 80/100 180/150 B/181 180/150 80/100 180/150 80/100 180/150 0.0069 0.174 200/160 200/160
100/120 150/125 151 100/120 150/125 B/151 150/125 100/120 150/125 100/120 150/125 0.0058 0.148 160/125 160/125
120/140 125/106 126 120/140 125/106 B/126 125/106 120/140 125/106 120/140 125/106 0.0048 0.123 125/100 125/100
140/170 106/90 107 140/170 106/90 B/107 106/90 140/170 106/90 140/170 106/90 0.0041 0.103 100/80 100/80
170/200 90/75 91 170/200 90/75 B/91 90/75 170/200 90/75 170/200 90/75 0.0034 0.086 80/63 80/63
200/230 75/63 76 200/230 75/63 B/76 75/63 200/230 75/63 200/230 75/63 0.003 0.075 63/50 63/50
230/270 63/53 64 230/270 63/53 B/64 63/53 230/270 63/53 230/270 63/53 0.0026 0.066 50/40 50/40
270/325 53/45 54 270/325 53/45 B/54 53/45 270/325 53/45 270/325 53/45 0.0022 0.057 - -
325/400 45/38 46 325/400 45/38 B/46 45/38 325/400 45/38 325/400 45/38 0.0019 0.048 - -
Feature

Nickel - 30%,56% or 60% by weight, or any customized specification
Copper - 50% by weight or any customized specification
Used to enhance bond retention
Allows for better heat dissipation
Can be Customized based on customers' demand

Characteristics

Bonding strength between diamond/CBN and binding agent increased, also grit's holding strength.
The coated layer can separate air, increase heat dissipation, reduce thermal damage to diamond/CBN.
It can blanket particle defects and uplift their strength.

Application

Chemical nickel coating mainly for resin bond products.
Electro nickel coating mainly for resin bond products.
Copper coating mainly for metal bond products.
Ti coating mainly for metal and ceramic bond products.

Production process

Adopting advanced composite plating process, the product has dense coating and high grinding ability;
Increase the holding force between the abrasives and the bond between the abrasives and reduce the diamond particles from the substrate;
The heat dissipation capability is high, and the thermal shock is slowed down so that the diamond can be carbonized from the impact of the instantaneous high temperature;
In high temperature sintering and high temperature grinding, the coating plays a protective role on the diamond, preventing diamond carbonization, oxidation and so on;
Self sharpening, can maintain good grinding efficiency and service life.
It can improve the electrical conductivity and chemical properties of diamond.

Cu Ni Ti Cladding Diamond Grain for Making Diamond Grinding Wheel

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