Polycrystalline Diamond Dust Powder for Sapphire Wafer

Product Description

Ultra Detonated Polycrystalline Diamond Powder

Product Description

Polycrystalline diamond powder is a nano-diamond polymer synthesized by transient ultra-high pressure and high temperature explosion, which is similar to the black diamond found in a small number of meteorites in nature. It is a polycrystal composed of cubic diamond and hexagonal diamond. It has the characteristics of high toughness, high self-sharpening and high hardness. As a new type of abrasive material, it has the irreplaceable advantages of other materials in sapphire grinding and processing. The grinding efficiency is 2 to 4 times that of single crystal diamond, and it does not produce scratches, and has a high finish. It has a wide range of applications in high-tech fields such as electronics, aerospace, and aviation. Due to the continuous expansion of the application fields of new technologies in industries such as LEDs in recent years, the use of polycrystalline diamond powder has increased significantly, and the demand has continued to increase.

Available Size

Available Sizes of Polycrystalline Diamond Powder:

Range	0-1	1-2	1-3	2-4	2-5	3-6	3-7	4-8	5-10	6-12	8-12
HID PD	√	√	√	√	√	√	√	√	√	√	√

 

Particle Size Distribution Specification for Superabrasive Grains

Size	D10≥(µm)	D50(µm)	D95≤(µm)	Max(µm)	Min(µm)
0-0.25	0.1	0.170~0.210	0.38	--	--
0-0.5	0.12	0.220~0.280	0.51	---	--
0-1	0.42	0.501~0.580	0.795	1.156	0.375
0.5-1	0.472	0.581~0.690	1.053	1.375	0.375
0.5-1.5	0.504	0.691~0.871	1.298	1.945	0.375
0-2	0.62	0.872~0.985	1.542	2.312	0.446
1/2	0.761	0.986~1.224	1.894	3.27	0.63
0.5-3	0.94	1.225~1.487	2.401	3.889	0.63
1/3	1.048	1.488~1.712	2.882	4.625	0.75
1.5-3	1.169	1.713~2.014	3.321	5.5	0.75
2/3	1.392	2.015~2.302	3.663	6.541	0.892
2/4	1.644	2.303~2.754	4.496	7.778	0.892
2/5	1.803	2.755~3.312	5.5	9.25	1.06
3/6	2.448	3.313~3.898	6.386	11	1.499
3/7	2.913	3.899~4.676	7.566	13.08	1.783
4/8	3.605	4.677~5.400	8.455	15.56	2.121
4/9	3.952	5.401~6.062	9.762	18.5	2.522
5/10	4.401	6.063~6.700	10.98	18.5	2.999
5/12	5.022	6.701~7.673	12.95	22	3.566
6/12	5.807	7.674~8.549	13.97	26.16	4.241
7/14	6.411	8.550~9.483	15.13	26.16	4.241
8/16	7.113	9.484~10.78	17.82	31.11	5.044
8/20	8.102	10.79~12.56	20.6	37	5.998
10/20	9.186	12.57~14.18	22.54	37	7.133
12/22	10.53	14.19~16.05	24.41	44	7.133
12/25	12.01	16.06~17.65	26.61	44	8.482
15-25	13.32	17.66~19.55	29.75	52.33	10.09
20-30	15.04	19.56~22.50	34.64	62.23	12
22-36	17.28	22.51~26.12	39.98	74	12
30-40	20.11	26.13~30.10	46.56	88	14.27
30-50	22.36	30.11~34.58	52.87	88	16.96
36-54	25.68	34.59~39.00	60.94	104.7	20.17
40-60	29.45	39.01~43.20	69.86	124.5	20.17
50-70	32.42	43.21~47.50	72.65	124.5	23.99
54-80	36.56	47.51~52.50	80.74	124.5	23.99

Detailed Photos

Feature

Tight, customized particle size distribution
Blocky and rough particle surface
Stringent oversize control
Low scratch count
Self-sharpening with high material removal rate

Characteristics

- Detonation synthetic polycrystalline diamond micropowder has the expensive and rare polycrystalline structure of black natural diamond, which is dark gray, metallic luster, good toughness, and has the characteristics of automatic cutting edge.
- Compared with impact synthetic static pressure or natural single crystal diamond, silicon oxide, corundum and other abrasive materials, the grinding efficiency of polycrystalline diamond is 2 to 4 times higher.
- The grinding precision of polycrystalline diamond is unprecedentedly improved.
A. When using 2~4μm polycrystalline diamond powder to grind the workpiece, R<1.6nm.
B. When using 0~0.5μm polycrystalline diamond powder to grind the workpiece, Ra=1.3~1.4nm
C. When using 0~0.125μm polycrystalline diamond powder to grind the workpiece, Ra<0.1nm
D. Due to the "ball" shape of the polycrystalline diamond surface, no scratches will be left on the surface of the workpiece to be polished, thereby improving the polishing yield.
E. Polycrystalline diamond powder can also be plated on the inner wall of a workpiece (such as a cylinder) through an electroless plating method, and its wear resistance is better than any other material.

Application

- Polishing sapphire, silicon, ceramics, metals, etc.
- Processing of magnetic head materials, antimagnetic films (MR), multilayer films, sputtering films, molecular beam epitaxy (MBE), ferrite and printing plates.
- Processing fiber optic connectors, laser rods and other products that require certain light waves to pass through.

 

Workpieces Processing

- Silicon wafers, monocrystalline and polycrystalline silicon, semiconductor wafers, photovoltaic wafers

- Sapphire phone screen, sapphire mobile phone screen saver, camera sapphire screen protective film

- Sapphire mobile phone camera protective film, mobile phone cover glass, sapphire watch mirror

- Precision cemented carbide, precision ceramics, optical glass and lens, etc.