Nano Diamond Slurry Grade HID-NDS
Feature:
It has the unique spherical microcrystalline loose structure of nano-diamond;
Unique hyperdispersion technology makes the product have good dispersion effect;
Angstrom-level surface processing effect can be achieved.
Specification:
Size(um) |
50 |
80 |
100 |
150 |
200 |
300 |
400 |
500 |
Media |
Water / Oil |
Water / Oil |
Water / Oil |
Water / Oil |
Water / Oil |
Water / Oil |
Water / Oil |
Water / Oil |
Application:
Semiconductor wafer polishing: single crystal silicon wafer, polycrystalline silicon wafer, sapphire wafer, silicon carbide wafer, etc.;
Polishing of magnetic recording materials: computer hard disk substrates, computer hard disk heads, etc.
Single Crystal Diamond Slurry Grade HID-SDS
Feature:
Selected particle shapes
Strict granularity control
Unique formulations for different applications.
Specification:
Size(um) |
Media |
Size(um) |
Media |
Size(um) |
Media |
0.05 |
Water / Oil |
0-1 |
Water / Oil |
8-16 |
Water / Oil |
0.08 |
Water / Oil |
1-2 |
Water / Oil |
10-20 |
Water / Oil |
0.1 |
Water / Oil |
1-3 |
Water / Oil |
20-30 |
Water / Oil |
0.2 |
Water / Oil |
2-4 |
Water / Oil |
30-40 |
Water / Oil |
0.25 |
Water / Oil |
4-8 |
Water / Oil |
40-60 |
Water / Oil |
0.5 |
Water / Oil |
6-12 |
Water / Oil |
|
Water / Oil |
Application:
1. Metal material processing: stainless steel, die steel, aluminum alloy and other metal materials
2. Other material processing: optical glass, cemented carbide, etc.
Polycrystalline Diamond Slurry Grade HID-PDS
Feature:
Selected polycrystalline diamond abrasives;
High cutting force and good surface processing effect can be achieved in the processing of high hardness wafers;
A variety of carriers are available for different processing areas.
Specification:
Size(um) |
Media |
Size(um) |
Media |
Size(um) |
Media |
0.05 |
Water / Oil |
0-1 |
Water / Oil |
8-16 |
Water / Oil |
0.08 |
Water / Oil |
1-2 |
Water / Oil |
10-20 |
Water / Oil |
0.1 |
Water / Oil |
1-3 |
Water / Oil |
20-30 |
Water / Oil |
0.2 |
Water / Oil |
2-4 |
Water / Oil |
30-40 |
Water / Oil |
0.25 |
Water / Oil |
4-8 |
Water / Oil |
40-60 |
Water / Oil |
0.5 |
Water / Oil |
6-12 |
Water / Oil |
|
Water / Oil |
Application:
1. Semiconductor wafer processing: mainly including sapphire substrates, silicon carbide wafers, sapphire windows, etc.
2. Ceramic processing: zirconia fingerprint identification sheet, zirconia ceramic mobile phone back shell and other functional ceramics
3. Metal material processing: stainless steel, die steel, aluminum alloy and other metal materials.
Polycrystalline-Like Diamond Slurry Grade HID-PLDS
Feature:
It is an economical alternative to polycrystalline diamond slurry;
The grinding effect of polycrystalline diamond slurry can be achieved in the processing of various semiconductor wafers.
Specification:
Size(um) |
0.25 |
0.5 |
1 |
3 |
4 |
6 |
Media |
Water / Oil |
Water / Oil |
Water / Oil |
Water / Oil |
Water / Oil |
Water / Oil |
Application:
Semiconductor wafer processing: mainly including sapphire substrates, silicon carbide wafers, sapphire windows, etc.
Ceramic material processing: zirconia fingerprint identification sheet, zirconia ceramic mobile phone back shell and other functional ceramics
Metal material processing: stainless steel, die steel, aluminum alloy and other metal materials.