High Effective High Quanlity Customized Dimond Grinding and Lapping Fluid for Alloys and Optical Glass

• Customization: Available
• Type: Diamond
• Classification of Diamond: Artificial
• Model NO.: HID NDS
• Characteristic: Silicon Carbide, Diamond
• Characteristics of Natural Diamond: Grinding and Polishing
• Application: Polishing of Magnetic Recording Material
• Feature: High Efficiency
• Types: Abrasive
• Usage: Surface Polishing
• Auxiliary Equipment: Polishing Pad, Grinding Disc
• Transport Package: Bottle
• Specification: 500 ml per Bottle
• Trademark: Harmony
• Origin: Zhengzhou China
• HS Code: 34059000
• Production Capacity: 80, 000 Liter

Product Description

Nano Diamond Slurry Grade HID-NDS
Feature:
It has the unique spherical microcrystalline loose structure of nano-diamond;
Unique hyperdispersion technology makes the product have good dispersion effect;
Angstrom-level surface processing effect can be achieved.

Specification:

Size(um)	50	80	100	150	200	300	400	500
Media	Water / Oil	Water / Oil	Water / Oil	Water / Oil	Water / Oil	Water / Oil	Water / Oil	Water / Oil

Application:
Semiconductor wafer polishing: single crystal silicon wafer, polycrystalline silicon wafer, sapphire wafer, silicon carbide wafer, etc.;
Polishing of magnetic recording materials: computer hard disk substrates, computer hard disk heads, etc.

Single Crystal Diamond Slurry Grade HID-SDS
Feature:
Selected particle shapes
Strict granularity control
Unique formulations for different applications.

Specification:

Size(um)	Media	Size(um)	Media	Size(um)	Media
0.05	Water / Oil	0-1	Water / Oil	8-16	Water / Oil
0.08	Water / Oil	1-2	Water / Oil	10-20	Water / Oil
0.1	Water / Oil	1-3	Water / Oil	20-30	Water / Oil
0.2	Water / Oil	2-4	Water / Oil	30-40	Water / Oil
0.25	Water / Oil	4-8	Water / Oil	40-60	Water / Oil
0.5	Water / Oil	6-12	Water / Oil		Water / Oil

Application:
1. Metal material processing: stainless steel, die steel, aluminum alloy and other metal materials
2. Other material processing: optical glass, cemented carbide, etc.

Polycrystalline Diamond Slurry Grade HID-PDS
Feature:
Selected polycrystalline diamond abrasives;
High cutting force and good surface processing effect can be achieved in the processing of high hardness wafers;
A variety of carriers are available for different processing areas.

Specification:

Size(um)	Media	Size(um)	Media	Size(um)	Media
0.05	Water / Oil	0-1	Water / Oil	8-16	Water / Oil
0.08	Water / Oil	1-2	Water / Oil	10-20	Water / Oil
0.1	Water / Oil	1-3	Water / Oil	20-30	Water / Oil
0.2	Water / Oil	2-4	Water / Oil	30-40	Water / Oil
0.25	Water / Oil	4-8	Water / Oil	40-60	Water / Oil
0.5	Water / Oil	6-12	Water / Oil		Water / Oil

Application:
1. Semiconductor wafer processing: mainly including sapphire substrates, silicon carbide wafers, sapphire windows, etc.
2. Ceramic processing: zirconia fingerprint identification sheet, zirconia ceramic mobile phone back shell and other functional ceramics
3. Metal material processing: stainless steel, die steel, aluminum alloy and other metal materials.

Polycrystalline-Like Diamond Slurry Grade HID-PLDS
Feature:
It is an economical alternative to polycrystalline diamond slurry;
The grinding effect of polycrystalline diamond slurry can be achieved in the processing of various semiconductor wafers.

Specification:

Size(um)	0.25	0.5	1	3	4	6
Media	Water / Oil	Water / Oil	Water / Oil	Water / Oil	Water / Oil	Water / Oil

Application:
Semiconductor wafer processing: mainly including sapphire substrates, silicon carbide wafers, sapphire windows, etc.
Ceramic material processing: zirconia fingerprint identification sheet, zirconia ceramic mobile phone back shell and other functional ceramics
Metal material processing: stainless steel, die steel, aluminum alloy and other metal materials.