Industrial Synthetic Diamond Micron Powder for Diamond Wire Saw Electroplated

Product Description

 

Monocrystalline Synthetic Industrial Diamond Micron Powder

Product Description

Single crystal diamond is produced by HPHT (high-pressure, high-temperature) synthesis. The diamond particles feature an oriented crystal structure with parallel-running cleavage planes, similar to natural diamond. For diamond tools, particle fracturing provides a self-sharpening mechanism and thus increases tool life. Single crystal diamond is a popular choice for precision grinding, lapping and polishing of various materials.

Using high-quality diamond as raw material, through our advanced technology of the precise and strict control of diamond particle classification, diamond strength, crystal shape and purity, we have achieved very narrow PSD, consistant crystal shape, extremely high particle surface purity, oversize control, and batch quality consistency.Using high-quality diamond as raw material, through our advanced technology of the precise and strict control of diamond particle classification, diamond strength, crystal shape and purity, we have achieved very narrow PSD, consistant crystal shape, extremely high particle surface purity, oversize control and batch quality consistency.

 

Particle Size Distribution Specification for Superabrasive Grains

Size	D10≥(µm)	D50(µm)	D95≤(µm)	Max(µm)	Min(µm)
0-0.25	0.1	0.170~0.210	0.38	--	--
0-0.5	0.12	0.220~0.280	0.51	---	--
0-1	0.42	0.501~0.580	0.795	1.156	0.375
0.5-1	0.472	0.581~0.690	1.053	1.375	0.375
0.5-1.5	0.504	0.691~0.871	1.298	1.945	0.375
0-2	0.62	0.872~0.985	1.542	2.312	0.446
1/2	0.761	0.986~1.224	1.894	3.27	0.63
0.5-3	0.94	1.225~1.487	2.401	3.889	0.63
1/3	1.048	1.488~1.712	2.882	4.625	0.75
1.5-3	1.169	1.713~2.014	3.321	5.5	0.75
2/3	1.392	2.015~2.302	3.663	6.541	0.892
2/4	1.644	2.303~2.754	4.496	7.778	0.892
2/5	1.803	2.755~3.312	5.5	9.25	1.06
3/6	2.448	3.313~3.898	6.386	11	1.499
3/7	2.913	3.899~4.676	7.566	13.08	1.783
4/8	3.605	4.677~5.400	8.455	15.56	2.121
4/9	3.952	5.401~6.062	9.762	18.5	2.522
5/10	4.401	6.063~6.700	10.98	18.5	2.999
5/12	5.022	6.701~7.673	12.95	22	3.566
6/12	5.807	7.674~8.549	13.97	26.16	4.241
7/14	6.411	8.550~9.483	15.13	26.16	4.241
8/16	7.113	9.484~10.78	17.82	31.11	5.044
8/20	8.102	10.79~12.56	20.6	37	5.998
10/20	9.186	12.57~14.18	22.54	37	7.133
12/22	10.53	14.19~16.05	24.41	44	7.133
12/25	12.01	16.06~17.65	26.61	44	8.482
15-25	13.32	17.66~19.55	29.75	52.33	10.09
20-30	15.04	19.56~22.50	34.64	62.23	12
22-36	17.28	22.51~26.12	39.98	74	12
30-40	20.11	26.13~30.10	46.56	88	14.27
30-50	22.36	30.11~34.58	52.87	88	16.96
36-54	25.68	34.59~39.00	60.94	104.7	20.17
40-60	29.45	39.01~43.20	69.86	124.5	20.17
50-70	32.42	43.21~47.50	72.65	124.5	23.99
54-80	36.56	47.51~52.50	80.74	124.5	23.99

 

Series of Micron Powder

- Premium Grade Micron Diamond HID A+

Description: Raw material is adopted from high technology MBD series of high quality diamond, more regular crystal shape with patented technology process, nearly spherical particle shape, more concentrated particle size distribution and low impurity content, very clean particle surface, easy to disperse to various types of vector and combined with various binders solidly.

Application: Suitable for precision grinding of optical glass, optical grinding pills films, optical grinding wheels, precision polishing wafers, precision grinding wheels of silicon materials for sapphire processing, precision machining tools for jade gem processing.

- Standard Grade Micron Diamond HID A

Description: Raw material is adopted from SCD series of high quality diamond, adopts the advanced production technology, combined with the unique particle shaping technology, produced base on international requirements standardization. With regular crystal shape and low impurity content, particle size distribution is in line with national standards.

Application: Traditional sawing, cutting, grinding, grinding, polishing, as well as a specific range of high-precision cutting, grinding, and polishing, can be used as raw materials for various types of diamond tools and diamond paste and slurry.

- Standard Grade Micron Diamond HID B

Description: Using medium strength diamond as raw material, the crystal shape of the product is regular, the impurity content is low, the grinding efficiency is high, and the particle size distribution meets the national standard.
Application: Suitable for ceramic bond abrasives, resin bond abrasives, all kinds of plating tools, grinding paste, grinding fluid.

- Economic Grade Micron Diamond HID G

Description: Raw material is adopted from RVD series of ordinary diamond, adopt the advanced production technology, produce base on international requirements standardization. With the irregular crystal shape, impurity content and particle size distribution is in line with national standards.

Application: Suitable for resin bond abrasive tools, all kinds of electroplating tools, grinding paste and slurry.

Characteristics

With our raw materials all from strictly quality-controlled suppliers, we pay more attention to all kinds of product standards to meet various application requirements from customers, such as: basic multiple edge particle feature, above international standard, basic particle contents at upper and lower limits, oversize control, low magnetic, hight surface purify.

Application

- Traditional gem polishing: single crystal powder or abrasive paste of about 3um is traditionally used
- Raw material for sintering PCD: Micron-sized powder is expanding with the application of PCD tools.
- Grinding and polishing of sapphire wafers: micron to sub-micron, polycrystalline/single crystal polishing liquid is developing rapidly with LED.
- Grinding and polishing of optical fiber connectors: micron to sub-micron, polishing film.
- Ceramic processing: single crystal or polycrystalline powder can be used. For example, fiber ceramic ferrule: single crystal powder from micron to sub-micron, application products include grinding wheel, grinding fluid, polishing film. The application prospects in this area are good.
- Magnetic head: such as grinding and polishing of GMR magnetic head, submicron ~ nanometer, polishing liquid/polishing film.
- Grinding and polishing of super-hard metal rollers or devices: micron to sub-micron, polishing film/abrasive paste/grinding wheel develops steadily.
- Polishing of metal molds: micron to sub-micron, diamond polishing liquid/grinding paste is developing steadily.
- Raw materials for various grinding tools: single crystals of various grain sizes, there is still broad room for development!