China Supplier Cu Coated Diamond Powder

Product Details
Customization: Available
Type: Diamond
Classification of Diamond: Artificial
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Diamond Member Since 2019

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  • China Supplier Cu Coated Diamond Powder
  • China Supplier Cu Coated Diamond Powder
  • China Supplier Cu Coated Diamond Powder
  • China Supplier Cu Coated Diamond Powder
  • China Supplier Cu Coated Diamond Powder
  • China Supplier Cu Coated Diamond Powder
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Basic Info.

Model NO.
Ni/Ti/Cu
Characteristic
High Hardness High Strength
Application
Polishing, Grinding, Abrasive
Certificate
ISO9001
Purity
99.9%
Delivery
3-5 Business Days
Coated Material
Ni/Ti/Cu/Si/W/Cr/Co
Transport Package
Plastic, Bottle, Carton
Specification
0-0.5um to 700/800
Trademark
Harmony
Origin
China
HS Code
71051020
Production Capacity
5, 000, 000 Carat/Year

Product Description

Red Cu Copper Coated Mesh Diamond Powder 100% Increased Weight

 

Description:

Plated diamond, also known as diamond coated or plated diamond, the diamond surface is coated with a layer of metal diamond gives many new features, in order to improve the diamond and matrix interfacial bonding ability, holding force and strength, reduce the thermal shock, protection against oxidation and graphitization of diamond, reduce the degree of thermal damage of diamond. To extend the service life of the product. The metal is nickel and titanium and alloy plating method commonly used ordinary plating and electroless plating two, weight method is usually 30% and 56%, in addition, can also according to the actual situation and the requirements of customers customized. General for nickel plated diamond and diamond coated powder.
Application: Mainly used for resin binder tools. it is widely used in the manufacture of metal bond and resin bond tools, such as knives, grinding wheels, saw blades and drills.
With the development of science and technology, the use of nickel coated diamond diamond wire cut sapphire wafer manufacturing more widely used.

 

Available Sizes:

Micron
4-6 4-8 5-10 6-12 8-12 8-16
10-15 10-20 12-22 15-25 20-30 22-36
20-40 30-40 35-45 40-50 45-50 50-60
Mesh
50/60 60/70 70/80 80/100 100/120 120/140
140/170 170/200 200/230 230/270 270/325 325/400

 

Particle Size Distribution Specification for Superabrasive Grains

Size D10≥(µm) D50(µm) D95≤(µm) Max(µm) Min(µm)
0-0.25 0.1 0.170~0.210 0.38 -- --
0-0.5 0.12 0.220~0.280 0.51 --- --
0-1 0.42 0.501~0.580 0.795 1.156 0.375
0.5-1 0.472 0.581~0.690 1.053 1.375 0.375
0.5-1.5 0.504 0.691~0.871 1.298 1.945 0.375
0-2 0.62 0.872~0.985 1.542 2.312 0.446
1/2 0.761 0.986~1.224 1.894 3.27 0.63
0.5-3 0.94 1.225~1.487 2.401 3.889 0.63
1/3 1.048 1.488~1.712 2.882 4.625 0.75
1.5-3 1.169 1.713~2.014 3.321 5.5 0.75
2/3 1.392 2.015~2.302 3.663 6.541 0.892
2/4 1.644 2.303~2.754 4.496 7.778 0.892
2/5 1.803 2.755~3.312 5.5 9.25 1.06
3/6 2.448 3.313~3.898 6.386 11 1.499
3/7 2.913 3.899~4.676 7.566 13.08 1.783
4/8 3.605 4.677~5.400 8.455 15.56 2.121
4/9 3.952 5.401~6.062 9.762 18.5 2.522
5/10 4.401 6.063~6.700 10.98 18.5 2.999
5/12 5.022 6.701~7.673 12.95 22 3.566
6/12 5.807 7.674~8.549 13.97 26.16 4.241
7/14 6.411 8.550~9.483 15.13 26.16 4.241
8/16 7.113 9.484~10.78 17.82 31.11 5.044
8/20 8.102 10.79~12.56 20.6 37 5.998
10/20 9.186 12.57~14.18 22.54 37 7.133
12/22 10.53 14.19~16.05 24.41 44 7.133
12/25 12.01 16.06~17.65 26.61 44 8.482
15-25 13.32 17.66~19.55 29.75 52.33 10.09
20-30 15.04 19.56~22.50 34.64 62.23 12
22-36 17.28 22.51~26.12 39.98 74 12
30-40 20.11 26.13~30.10 46.56 88 14.27
30-50 22.36 30.11~34.58 52.87 88 16.96
36-54 25.68 34.59~39.00 60.94 104.7 20.17
40-60 29.45 39.01~43.20 69.86 124.5 20.17
50-70 32.42 43.21~47.50 72.65 124.5 23.99
54-80 36.56 47.51~52.50 80.74 124.5 23.99

 

Abrasive Materials Mesh Size Comparison List

HARMONY      U.S.A  JAPAN    RUSSIA
GB/T6406-1995 ISO FEPA ANIS B74.16-1971 JIS4130-1988 Theoretlcal 9206-80
Baslc Size
Grain No Grain Size Grain No 1 Grain No 2 Grain Size Grain No Grain Size Grain No Grain Size Grain No Grain Size Inch Mlllmeter Grain No Grain Size
40/50 425/300 427 40/50 425/300 B/427 355/300 40/50 425/300 40/50 425/300 0.015 0.378 500/400 500/400
50/60 300/250 301 50/60 300/250 B/301 300/250 50/60 300/250 50/60 300/250 0.011 0.288 400/315 400/315
60/80 250/180 252 60/80 250/180 B/252 250/180 60/80 250/180 60/80 250/180 0.009 0.226 250/200 250/200
80/100 180/150 181 80/100 180/150 B/181 180/150 80/100 180/150 80/100 180/150 0.0069 0.174 200/160 200/160
100/120 150/125 151 100/120 150/125 B/151 150/125 100/120 150/125 100/120 150/125 0.0058 0.148 160/125 160/125
120/140 125/106 126 120/140 125/106 B/126 125/106 120/140 125/106 120/140 125/106 0.0048 0.123 125/100 125/100
140/170 106/90 107 140/170 106/90 B/107 106/90 140/170 106/90 140/170 106/90 0.0041 0.103 100/80 100/80
170/200 90/75 91 170/200 90/75 B/91 90/75 170/200 90/75 170/200 90/75 0.0034 0.086 80/63 80/63
200/230 75/63 76 200/230 75/63 B/76 75/63 200/230 75/63 200/230 75/63 0.003 0.075 63/50 63/50
230/270 63/53 64 230/270 63/53 B/64 63/53 230/270 63/53 230/270 63/53 0.0026 0.066 50/40 50/40
270/325 53/45 54 270/325 53/45 B/54 53/45 270/325 53/45 270/325 53/45 0.0022 0.057 - -
325/400 45/38 46 325/400 45/38 B/46 45/38 325/400 45/38 325/400 45/38 0.0019 0.048 - -

 

Feature:

- The conventional specifications of nickel-plated products are N30, N55, N56, etc., and different thicknesses of plating can be plated according to customer requirements.
- Copper and titanium-plated products can be plated with different thicknesses according to customer requirements.

 

Characteristic:

- This Series of products include chemical nickel plating, nickel plating, copper plating, titanium plating and other varieties.
- Products with various specifications and sizes between 8μm and 30 meshes are available.
- Various types of diamond and cubic boron nitride can be plated.
- The mature and stable plating process ensures that the plating layer is dense and uniform. Not only can the thickness of the plating layer and the weight of the metal be accurately controlled, but also the composite plating products of two metals can be provided according to customer requirements.
- The unique surface purification pretreatment process of abrasive particles makes the bonding force of diamond, cubic boron nitride and the coating stronger.
- Based on the experience of nano-level powder dispersion and surface treatment, it is ensured that there will be no adhesion phenomenon in the plated products with a thickness of 10μm.

 

Coated Diamond Series:
Grade HID Ni Coated Diamond
Description: Coated diamond is divided into electrolytic and chemical plating, it includes Ni coating, Cu coating, Ti coating, Cr coating etc. Coated diamond effectively increase holding force between diamond and bonding, reduce thermal shock, protect diamond against oxidation and graphite, lengthen product lifetime.

Application: Electroplating Nickel products mainly used in resin bond products with dry and wet abrasives, effectively improve the holding force with good thermal stable ability, avoid carbonization in high speed cutting. Chemistry plating Nickel products mainly used in resin bond products with dry and wet abrasives, no external current conditions, and deposited metal on diamond surface by process of self-catalytic redox reactions, form the thickness and density of nickel-plated.

China Supplier Cu Coated Diamond Powder

 

Grade HID Cu Coated Diamond
Description: Recommend for resin bond tools. Able to effectively enhance the tools life by improving the mechanical retention of diamonds and reducing heat damage.

Characteristics:
Effectively enhance the tools life by improving the mechanical retention of diamonds and reducing heat damage.

China Supplier Cu Coated Diamond Powder

 

Grade HID Ti Coated Diamond

The coating greatly enhances the mechanical attachment of diamond to the bond matrix through the strong metallurgical adhesion between Ti and the matrix. It also protects diamond from oxidation or metal erosion which causes graphitization of the diamond, therefore, improves the application features of diamond tools.

China Supplier Cu Coated Diamond Powder
 

Grade HID Si Coated Diamond
Silicon coating strengthens the retention between bond and diamond, improves the thermal stability, wear resistance and helps better conduct the heat. It also helps to avoid the corrosion from Fe, thus it protects the diamond, prolongs the tools' life and raises the sintering temperature.

 

Grade HID W Coated Diamond
W reacts with diamond particles and generates WC, which is with good thermal stability and wear resistance. The coating improves the bond retention and enhances the diamond toughness, its alloy coating layer improves the thermal conductivity, which can prolong tool life.

 

Grade HID Co Coated Diamond
Cobalt coating could improve the retention of diamond and bond. In addition, the sintering temperature could be raised because the coating can protect diamond from oxidation and corrosion. It also enhences the hardness and abrasive resistence of coated diamond.

 

Grade HID Cr Coated Diamond
Chromium enjoys nice wettability and affinity on diamond. It forms a layer of chromium-carbide between diamond and bond during coating and sintering, thus the coating improves the retention between diamond and bond. It also increases the hardness and abrasive resistance of coated diamond.

 

Application Field:

- Electroless nickel-plated diamond and cubic boron nitride are often used in resin bond and electroplated products.

- Electroplated nickel diamond and cubic boron nitride are often used in resin bond products.

- Copper-plated diamond and cubic boron nitride are often used in metal bond products.

- Titanium-coated diamond and cubic boron nitride are often used in metal and ceramic bond products.

China Supplier Cu Coated Diamond Powder

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