Metal Bonded Ultrathin Diamond Cutting Disc Diamond for Circuit Board

Product Details
Customization: Available
Blade Type: Resin Bonded
Manufacturing Process: Sintered
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Manufacturer/Factory, Trading Company
Diamond Member Since 2019

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  • Metal Bonded Ultrathin Diamond Cutting Disc Diamond for Circuit Board
  • Metal Bonded Ultrathin Diamond Cutting Disc Diamond for Circuit Board
  • Metal Bonded Ultrathin Diamond Cutting Disc Diamond for Circuit Board
  • Metal Bonded Ultrathin Diamond Cutting Disc Diamond for Circuit Board
  • Metal Bonded Ultrathin Diamond Cutting Disc Diamond for Circuit Board
  • Metal Bonded Ultrathin Diamond Cutting Disc Diamond for Circuit Board
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Basic Info.

Application
Cutting Carbide Alloy, Optical Glass, etc.
Delivery Time
10-15 Days
Capacity
2,000 Piece Each Day
Advantange
Thin Kerf Width and High Precision
OEM/ODM
Available
Transportation
by Courier / Air
Export
Russia, Germany, Americal, Korea, Sri Lanka, Japan
Transport Package
Carton
Specification
3" - 14"
Trademark
Harmony
Origin
Zhengzhou China
HS Code
82023910
Production Capacity
60, 000 Piece Each Month

Product Description

Application: Mainly used in glass, fine ceramics, magnetic materials, semiconductor packaging, electronic components, grinding materials, hard metal and other industries used in a variety of ultra-thin diamond cutting disc
Metal Bonded Ultrathin Diamond Cutting Disc Diamond for Circuit Board
Metal Bonded Ultrathin Diamond Cutting Disc Diamond for Circuit Board
Metal Bonded Ultrathin Diamond Cutting Disc Diamond for Circuit Board
Metal Bonded Ultrathin Diamond Cutting Disc Diamond for Circuit Board
Metal Bonded Ultrathin Diamond Cutting Disc Diamond for Circuit Board
Metal Bonded Ultrathin Diamond Cutting Disc Diamond for Circuit Board

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