Ultra Detonated Polycrystalline Diamond Powder for Sapphire Wafer

• Type: Diamond
• Classification of Diamond: Artificial
• Characteristic: High Hardness
• Characteristics of Natural Diamond: Compressive Strength
• Application: Superfine Polishing
• Crystal Shape: Polycrystalline
• Model NO.: HID PD
• Color: Black
• Production Method: Ultra Detonated
• Hardness: Superabrasives
• Characteristics: Rate of Heat Dissipation
• Particle Size: Dust, Powder
• Usage: Ultra-Precision Grinding and Polishing
• Function: Surface Polishing
• Applications: Sapphire Wafer
• Delivery Time: 3-5 Business Days
• Shipment: DHL, TNT, UPS, FedEx and EMS
• OEM: Available
• Transport Package: Bottle, Plastic
• Specification: ISO 9001
• Trademark: Harmony
• Origin: Zhengzhou China
• HS Code: 71051020
• Production Capacity: 2, 000, 000 Carat/Year

Product Description

Detonated diamond lapping powder, 8-12um diamond lapping powder, 1um diamond abrasive powder
Polycrystalline diamond, is synthesized by detonation method. The color is grayish black, slightly metallic; It is composed of nano-crystallites that give it a unique break down mechanism, which allows new cutting edges to be exposed creating a self-sharpening characteristic. In the application, nano-crystallites break down gradually, resulting in more crystal edges and grinding surfaces. Therefore, polycrystalline diamond has the characteristics of high removal rate, self-sharpening and high toughness, which not only ensures the surface finish of workpieces, but also improves the grinding efficiency, it shows its unique superiority in the processing of some high quality products.

 

Available Sizes of Polycrystalline Diamond Powder:

Range	0-1	1-2	1-3	2-4	2-5	3-6	3-7	4-8	5-10	6-12	8-12
HID PD	√	√	√	√	√	√	√	√	√	√	√

 

Particle Size Distribution Specification for Superabrasive Grains

Size	D10≥(µm)	D50(µm)	D95≤(µm)	Max(µm)	Min(µm)
0-0.25	0.1	0.170~0.210	0.38	--	--
0-0.5	0.12	0.220~0.280	0.51	---	--
0-1	0.42	0.501~0.580	0.795	1.156	0.375
0.5-1	0.472	0.581~0.690	1.053	1.375	0.375
0.5-1.5	0.504	0.691~0.871	1.298	1.945	0.375
0-2	0.62	0.872~0.985	1.542	2.312	0.446
1/2	0.761	0.986~1.224	1.894	3.27	0.63
0.5-3	0.94	1.225~1.487	2.401	3.889	0.63
1/3	1.048	1.488~1.712	2.882	4.625	0.75
1.5-3	1.169	1.713~2.014	3.321	5.5	0.75
2/3	1.392	2.015~2.302	3.663	6.541	0.892
2/4	1.644	2.303~2.754	4.496	7.778	0.892
2/5	1.803	2.755~3.312	5.5	9.25	1.06
3/6	2.448	3.313~3.898	6.386	11	1.499
3/7	2.913	3.899~4.676	7.566	13.08	1.783
4/8	3.605	4.677~5.400	8.455	15.56	2.121
4/9	3.952	5.401~6.062	9.762	18.5	2.522
5/10	4.401	6.063~6.700	10.98	18.5	2.999
5/12	5.022	6.701~7.673	12.95	22	3.566
6/12	5.807	7.674~8.549	13.97	26.16	4.241
7/14	6.411	8.550~9.483	15.13	26.16	4.241
8/16	7.113	9.484~10.78	17.82	31.11	5.044
8/20	8.102	10.79~12.56	20.6	37	5.998
10/20	9.186	12.57~14.18	22.54	37	7.133
12/22	10.53	14.19~16.05	24.41	44	7.133
12/25	12.01	16.06~17.65	26.61	44	8.482
15-25	13.32	17.66~19.55	29.75	52.33	10.09
20-30	15.04	19.56~22.50	34.64	62.23	12
22-36	17.28	22.51~26.12	39.98	74	12
30-40	20.11	26.13~30.10	46.56	88	14.27
30-50	22.36	30.11~34.58	52.87	88	16.96
36-54	25.68	34.59~39.00	60.94	104.7	20.17
40-60	29.45	39.01~43.20	69.86	124.5	20.17
50-70	32.42	43.21~47.50	72.65	124.5	23.99
54-80	36.56	47.51~52.50	80.74	124.5	23.99

 

Feature:

Tight, customized particle size distribution
Blocky and rough particle surface
Stringent oversize control
Low scratch count
Self-sharpening with high material removal rate

Characteristics:

Round particle shape, no irregular shapes like pencils or flakes.
Oversizes completely removed.
Narrow PSD.
Surface purity can reach ppm level.
Outstanding dispersibility.

Application for Polycrystalline Diamond Powder HID PD:

Polycrystalline diamond is primarily for high-performance grinding and polishing process. It can be widely used for grinding and polishing of silicon wafer, ruby, sapphire, optical lens, metallographic sample, optical fiber communication and ceramics in IT industry, as well as disc modification, magnetic head polishing and substrate grinding.

Lapping and polishing of semiconductor wafers such as SiC and sapphire wafers

Surface polishing of various ceramics

Surface treatment of metals, such as stainless steel and aluminium alloy.

Workpieces Processing

- Silicon wafers, monocrystalline and polycrystalline silicon, semiconductor wafers, photovoltaic wafers

- Sapphire phone screen, sapphire mobile phone screen saver, camera sapphire screen protective film

- Sapphire mobile phone camera protective film, mobile phone cover glass, sapphire watch mirror

- Precision cemented carbide, precision ceramics, optical glass and lens, etc.